Microstructure and properties of copper coating prepared by explosive compaction-coating
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摘要: 利用爆炸压涂技术在铜基板上制备了较大面积的铜涂层，详细阐述了爆炸压涂技术的工艺。利用光学显微镜、扫描电镜观察了铜涂层的微观组织结构，涂层的厚度为280μm，用截线法在涂层的显微结构图上测得其孔隙率为约2%，利用显微硬度计测量了涂层的显微硬度hV0.05=114，还利用能谱分析测量了粉末和涂层中各元素的质量分数，实验前后元素的组成成分基本没有发生变化。爆炸压涂制备的铜涂层具有较好的均匀性和致密性，铜粉末在形成涂层的过程中不会发生氧化现象。Abstract: The explosive compaction-coating technology was introduced in detail and was used to prepare the large-area copper coating.And the surface morphology, element content and thickness of the prepared copper coating were investigated by means of optical microscope, scanning electron microscopy and energy dispersion spectrum.The porosity of the copper coating was measured by the quantitative line method in its SEM photograph.The hardness of the copper coating was observed by a microhardness tester.The thickness of the copper coating was 280μm, the porosity was about 2%, the average microhardness was about 114HV0.05, and the element content remained roughly constant before and after the experiment.The results show that the prepared copper coating has excellent uniformity and compactness and no oxidation of the copper powder can occur during the process of the copper coating formation.
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Key words:
- mechanics of explosion /
- porosity /
- explosive compaction-coating /
- copper coating /
- oxidation
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表 1 涂层和铜板的显微硬度
Table 1. Microhardness of coating and copper plate
No. hV0.05, coating hV0.05, plate 1 117 114 2 107 121 3 114 118 4 119 114 平均 114 117 
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表 2 铜粉末和涂层的元素组成
Table 2. Element composition of powder and coating
元素 wpower/% wcoating/% C 0.37 0.49 O 3.53 4.48 Cu 96.11 95.03
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