Volume 42 Issue 5
May  2022
Turn off MathJax
Article Contents
QIN Feng, LI Juntao, LI Jinzhu, YANG Yingkun, GAO Lei. Analysis for impact resistance of the high-voltage power module with different fixed modes[J]. Explosion And Shock Waves, 2022, 42(5): 053204. doi: 10.11883/bzycj-2021-0269
Citation: QIN Feng, LI Juntao, LI Jinzhu, YANG Yingkun, GAO Lei. Analysis for impact resistance of the high-voltage power module with different fixed modes[J]. Explosion And Shock Waves, 2022, 42(5): 053204. doi: 10.11883/bzycj-2021-0269

Analysis for impact resistance of the high-voltage power module with different fixed modes

doi: 10.11883/bzycj-2021-0269
  • Received Date: 2021-06-30
  • Rev Recd Date: 2022-02-22
  • Available Online: 2022-04-06
  • Publish Date: 2022-05-27
  • High-voltage power module is a key component to realize stable current output. In order to improve the structural reliability of the high-voltage power module and optimize the fixed modes under high-speed impact, the impact resistance characteristics with different fixed modes are studied. Based on the one-dimensional stress wave theory, the comparison of deformation energy and kinetic energy of the module with different fixed modes are obtained by analyzing the dynamic response and energy conversion form of the module on the free Hopkinson pulse bar (FHPB). The finite element method is used to simulate the processes of motion and deformation under impact velocity of 20 m/s. The stress distributions, the deflection curves, the velocity curves, and the acceleration curves of the module under the same impact are obtained. It is found that the maximum stress (427 MPa) appears at the ceramic layer, while the maximum deflection (773.8 μm) occurs at the metal substrate layer. The magnitude of the maximum displacement speed is up to 17.68 m/s, and the magnitude of the maximum acceleration is up to 51 110.7g. By comparing the impact response results of the four fixed modes, the deformation of bottom substrate from small to large is the surface mounting, four-corner point fixing, two-point fixing on the short side and two-point fixing on the long side. The highest kinetic energy and acceleration are produced on the surface mounting modules. The results indicate that a minimum failure probability exists on surface mounting module under high impact loading. In summary, surface mounting is the most reliable fixed method among the four fixed methods. Then, the selection priorities are as following: the four-corner fixing, two-point fixing on the short side and two-point fixing on the long side. Out study results would provide an important theoretical basis of the mounting and fixing methods for semiconductor high-voltage power modules in practical application.
  • loading
  • [1]
    SAMAVATIAN V, MASOUMIAN A, MAFI M, et al. Influence of directional random vibration on the fatigue life of solder joints in a power module [J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019, 9(2): 262–268. DOI: 10.1109/TCPMT. 2018.2838148.
    [2]
    HUANG C, WU K, WANG Z Y. Mechanical reliability testing of air-gap through-silicon vias [J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2016, 6(5): 712–721. DOI: 10.1109/TCPMT. 2016.2544762.
    [3]
    SHAMMAS N Y A. Present problems of power module packaging technology [J]. Microelectronics Reliability, 2003, 43(4): 519–527. DOI: 10.1016/S0026-2714(03)00019-2.
    [4]
    YU Q, KIKUCHI H, IKEDA S, et al. Dynamic behavior of electronics package and impact reliability of BGA solder joints[C]//Proceedings of the 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. San Diego: IEEE, 2002: 953–960. DOI : 10.1109/ITHERM.2002.1012559.
    [5]
    周新. 板级无铅焊点跌落冲击载荷下可靠性分析[D]. 上海: 上海交通大学, 2007: 43–46.

    ZHOU X. Board level lead-free solder joints reliability analysis under drop shock loading[D]. Shanghai: Shanghai Jiaotong university, 2007: 43–46.
    [6]
    TEE T Y, LUAN J E, PEK E, et al. Novel numerical and experimental analysis of dynamic responses under board level drop test[C]// Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems. Brussels: IEEE, 2004: 133–140. DOI: 10.1109/ESIME.2004.1304032.
    [7]
    WONG S F, MALATKAR P, RICK C, et al. Vibration testing and analysis of ball grid array package solder joints[C]// Proceedings of the 57th Electronic Components and Technology Conference. Sparks: IEEE, 2007: 373–380. DOI: 10.1109/ECTC.2007.373825.
    [8]
    姬永强, 李映辉, 聂飞. 弹载数据存储模块抗高过载防护技术研究 [J]. 振动与冲击, 2012, 31(18): 104–106. DOI: 10.13465/j.cnki.jvs.2012.18.018.

    JI Y Q, LI Y H, NIE F. Protection technology for onboard data storage module against high overload [J]. Journal of Vibration and Shock, 2012, 31(18): 104–106. DOI: 10.13465/j.cnki.jvs.2012.18.018.
    [9]
    陈明祥. 弹塑性力学[M]. 北京: 科学出版社, 2007: 115–118.
    [10]
    王礼立. 应力波基础[M]. 北京: 国防工业出版社, 1985: 51–59.
    [11]
    王娜, 沈瑞琪, 叶迎华. 霍普金森杆测量火工品过载情况的研究与数值模拟 [J]. 火工品, 2004, 1: 42–47. DOI: 10.3969/j.issn.1003-1480.2004.01.014.

    WANG N, SHEN R Q, YIE Y H. Study on the measurement of over-loaded initiator by Hopkinson bar and numerical simulation [J]. Initiators and Pyrotechnics, 2004, 1: 42–47. DOI: 10.3969/j.issn.1003-1480.2004.01.014.
    [12]
    王吉会, 郑俊萍, 刘家臣, 等. 材料力学性能[M]. 天津: 天津大学出版社, 2006: 66–70.
  • 加载中

Catalog

    通讯作者: 陈斌, bchen63@163.com
    • 1. 

      沈阳化工大学材料科学与工程学院 沈阳 110142

    1. 本站搜索
    2. 百度学术搜索
    3. 万方数据库搜索
    4. CNKI搜索

    Figures(13)  / Tables(2)

    Article Metrics

    Article views (470) PDF downloads(53) Cited by()
    Proportional views
    Related

    /

    DownLoad:  Full-Size Img  PowerPoint
    Return
    Return